PCB Via Strom Rechner
Schätzen Sie PCB via current carrying capacity aus diameter, plating thickness, and temperature rise.
Current Capacity
2.97 A
Current Capacity vs Via Outer Diameter
Formel
## PCB Via Current Capacity ### Approach A via is a hollow copper cylinder. Its cross-section is: **A = pi x D x t_plating** Apply the IPC-2221 trace formula to this cross-section to estimate current capacity. For high current, use multiple vias in parallel.
Lösungsbeispiel
0.6 mm diameter via, 25 um plating, 1.6 mm board, 10C rise.
- 01Circumference = pi x 0.6 / 0.0254 = 74.2 mils
- 02Plating = 25 / 25.4 = 0.984 mils
- 03Area = 74.2 x 0.984 = 73.0 mils^2
- 04Current = 0.048 x 10^0.44 x 73^0.725 = ~2.8 A
Häufig Gestellte Fragen
How many vias for high current?
Divide required current by per-via capacity and add margin. 10 A typically needs 4-5 standard vias.
Does via fill help?
Copper-filled vias have much higher current capacity and lower thermal resistance than hollow plated vias.
What about thermal vias?
Thermal vias transfer heat between layers to heat sinks. Use many small vias in a grid pattern under thermal pads.
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